TAECL has developed a new generation alternative to the traditional methods using usual PCB techniques for SSRs. The new technique, the DCB technology, virtually eliminates mismatching and repeated expansion at solid interface. The thermal expansion co-efficient of the bonded unit more closely matches with that of the semi conductor device, fatigue due to thermal expansion is greatly reduced. This method provides lower thermal junction to case resistance. This DCB technology is the basis for the development of integrated power semi conductor SSR’s with soldered heavy-duty chips upto 300 Amp, in the same package in which generally upto 40 Amp  SSR’s are available.

    MAIN FEATURES:

· SSRs available in Triac  upto 40 Amp.
· SSR's available in Back to Back SCRs upto 150 Amp. - A achievement.
· High mechanical strength, dimensional stability, high bond strength & corrosion resistance.
· Provides a non-stop method of connecting to the packaging exterior & the power generating semiconductors,
· Provides a path for high currents, including high-surge currents.
· Excellent electrical insulation.
· Good spreading of the dissipation heat generated by the chips to the entire substrate surface.
· Very high thermal conductivity combined with excellent resistance to cyclic temperature stress.
· Matched expansion co-efficient of the DCB ceramics permits soldering of the large chips without molybdenum    discs.
· Low thermal transition resistance between the chip capacity utilization
· Completely potted & therefore insensitive against shock & vibrations as well as against corrosive environmental conditions (chemicals)